１）Enhanced reliability
Generally speaking, silicone-based encapsulation materials for LED are only available in a liquid
form. Building on its proprietary technologies, Nitto Denko succeeded in turning its liquid
thermosetting encapsulation resin into a gel-like sheet by utilizing a special silicone resin as a
base. The sheet does not cause any damage to LED bonding wires when laminated onto LED devices,
because of its gel-like, semi-hard property.
The sheet’s relatively small shrinking rate upon the completion of the thermosetting process also
contributes to enhanced reliability.
２）Enhanced productivity
The sheet made it possible to encapsulate a large area at once and the whole encapsulation process is
now greatly simplified because there is no need for setting up a “dam” to keep the liquid material in
place. Compared to the conventional “potting” method with liquid encapsulation materials adopted at
IDEC, the new sheet-encapsulation process requires only about one-ninth of the previously required
time for completion.
３）Improved color consistency
In the conventional method with liquid encapsulation materials, it took a certain period of time until
the liquid was completely set solid, so that the phosphor material inside the liquid sedimentate to
the bottom in the process and they caused variation of a finished LED’s color. With Nitto Denko’s new
encapsulation sheet, such concerns can be eliminated. In addition to lessened color variation by half
(compared to IDEC’s conventional method), the skipping of blending and mixing steps contributed to the
productivity enhancement.
４）Less-expensive initial investment
Thanks to the now simplified production process, only one-tenth of the initial capital investment is
needed compared to the conventional production line. (Internal trial calculation)
